R& D Technical Semiconductor Process Integration Engineer Contract Job China

Job Responsibilities

1. **Technical Pre - research and Innovation**

    - Lead the development of forward - looking technologies (such as new bonding materials, surface micro - nano processing, 3D integration, etc.) and explore feasible paths for process implementation.

    - Design experiments to verify the compatibility of new process modules with existing manufacturing processes.

2. **Process Integration Prototype Development**

    - Establish a new process integration framework and formulate cross - module collaboration plans.

    - Verify key parameters through Design of Experiments (DOE) and output Technical Design Rules.

    - Be proficient in conducting in - depth analysis from the execution results of the plan to the process mechanism.

3. **Cross - team Collaboration and Transformation**

    - Collaborate with TD (Technical R&D), production processes, etc., to transform laboratory - level technologies into manufacturable solutions.

    - Participate in formulating the technical roadmap, and assess the requirements for equipment and materials as well as technical risks of new processes.

4. **Intellectual Property and Academic Output**

    - Write technical patents and participate in the formulation of industry technical standards.

    - Track top - tier international conference papers (such as IEDM, VLSI), and extract implementable technical directions.

Competency Requirements

1. **Hard Skills**

    - **Technical Vision**: Have an in - depth understanding of cutting - edge semiconductor technologies (such as heterogeneous integration).

    - Candidates with simulation and modeling capabilities will be preferred.

    - **Experimental Design Ability**: Be proficient in designing DOE experiments with wide coverage and high complexity to quickly converge on technical paths.

2. **Soft Skills**

    - **Innovative Thinking**: Break through the existing technical framework and propose disruptive process integration solutions.

    - **Academic Acumen**: Extract key technical points from papers and patents and convert them into experimental directions.

    - **Interdisciplinary Collaboration**: Jointly develop customized solutions with materials scientists and equipment manufacturers.

Other Requirements

1. **Educational Background**

    - **Degree**: A doctoral degree is preferred, majoring in microelectronics, physics, materials science and engineering, chemistry, mechanical engineering, etc.

    - **Research Directions**: Nanodevice physics, advanced process integration, new semiconductor materials, etc.

2. **Experience Requirements**

    - **Project Experience**: Have participated in national - level or enterprise - level advanced technology R&D projects.

    - **Technical Achievements**: Have published highly - influential papers or led the writing of key patents.